73 ?2010 littelfuse, inc. revised: august 19, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array sp3004 lead-free/green series lead-free/green sp3004 description features applications the sp3004 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each i/o pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level ( level 4) speci?ed in the iec 61000-4-2 international standard without performance degradation. their very low loading capacitance also makes them ideal for protecting high speed signal pins such as hdmi, dvi, usb2.0, and ieee 1394. sp3004 lead-free/green series rohs pb green t - p x d b q b d j u b o d f p g 0.85pf (typ) per i/o t & 4 % q s p u f d u j p o p g ? l 7 contact discharge, ? l 7 b j s e j t d i b s h f
(iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m 4 0 5 q b d l b h f saves board space t - j h i u o j o h 1 s p u f d u j p o
iec61000-4-5, 4a (8/20s) t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t 1 % " t t % j h j u b m $ b n f s b t t / f u x p s l ) b s e x b s f 1 p s u t t 5 f t u & r v j q n f o u t . f e j d b m & r v j q n f o u pinout functional block diagram i/o2 i/o1 gnd i/o3 v cc i/o4 i/o 1 i/o 2 v cc i/o 3 i/o 4 gnd hf - j g f 4 v q q p s u / p u f not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
74 revised: august 19, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products low capacitance esd protection array sp3004 lead-free/green series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 4 a t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 10.0 12.0 v i pp =2a, t p =8/20s, fwd 11.8 15.0 v esd withstand voltage 1 v esd iec61000-4-2 (contact) ? kv iec61000-4-2 (air) ? kv diode capacitance 1 c * 0 ( / % reverse bias=0v 0.95 1.1 1.25 pf reverse bias=1.65v 0.7 0.85 1 pf diode capacitance 1 c i/o-i/o reverse bias=0v 0.5 pf / p u f 1 parameter is guaranteed by design and/or device characterization.
75 ?2010 littelfuse, inc. revised: august 19, 2010 spa? silicon protection array products speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array sp3004 lead-free/green series lead-free/green sp3004 capacitance vs. bias voltage insertion loss (s21) i/o to gnd capacitance vs. frequency -20 -15 -10 -5 0 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 frequency [hz] insertion loss [db] 0 2e-13 4e-13 6e-13 8e-13 1e-12 1.2e-12 1.4e-12 1.6e-12 1.8e-12 2e-12 1.e+06 1.e+07 1.e+08 1.e+09 frequency [hz] capacitance [f] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 i/o capacitance (pf) i/o dc bias (v) v cc = 5 v v cc = 3.3v v cc = float 1.50 1.40 1.30 1.20 1. 10 1. 0 0 0.90 0.80 0.70 0.60 0.50
76 revised: august 19, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products low capacitance esd protection array sp3004 lead-free/green series re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters application example clk+ gnd clk- d2+ gnd d2- d1+ gnd d1- d0+ gnd d0- hdmi or dvi connector hdmi or dvi interface ic d0+ d0- d1+ d1- d2+ d2- clk+ clk- 6 5 4 sp300x-0 4 1 2 3 +5v gnd 6 5 4 sp300x-0 4 1 2 3 hdmi or dvi application example for the littelfuse sp300x-04 protection devices. a single 4 channel sp300x-04 device can be used to protect four of the data lines in a hdmi/dvi interface. two (2) sp300x-04 devices provide protection for the main data lines. low voltage asic hdmi/dvi drivers can also be protected with the sp300x-04, the +v cc pins on the sp300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +v cc of the sp300x-04 can be n p b u f e p s / $
77 ?2010 littelfuse, inc. revised: august 19, 2010 sp a? silicon pr ot ection ar ray pr oducts speci?cations are subject to change without notice. please refer to http://www .littelfuse.com for current information. low capacitance esd protection array sp30 04 lead-f r ee/gr een ser ies lead-f ree/green sp30 04 pr oduct char act er istics or der ing inf or mation . y t q r e d r o . n i m g n i k r a m e g a k c a p r e b m u n t r a p g 3 6 5 t o s g t x 4 0 - 4 0 0 3 p s x4 50 0 0 lead plating pre-plated frame lead mat er ial copper allo y lead coplanar ity 0.0004 inc hes (0.1 02mm) subsit ut e mat er ial silicon body mat er ial molded epo xy flammability ul94-v -0 1 . all dimensions are in millimeters 2. dimensions include solder plating . 3. dimensions are e x clusiv e of mold ? ash & met al bur r . 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is f acing up f or mold and f acing do wn f or trim/f orm, i.e. re v erse trim/f orm. 6. p ac kage surf ace mat te ?nish vdi 1 1 -1 3. p a c k a g e d i men s i ons - s o t56 3 t o s e g a k c a p 563 6 s n i p millimeter s inc hes min max min max a 0.50 0.60 0.020 0.024 b 0.1 7 0.27 0.0 07 0.0 1 1 c 0.08 0.1 8 0.0 03 0.0 07 d 1 .50 1 .70 0.059 0.067 e 1 .1 0 1 .30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.1 0 0.30 0.0 04 0.0 1 2 he 1 .50 1 .70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 p ar t number ing s yst em p ar t mar king s yst em s p 3 00 4 - 04 x t g silicon protection array s eries number of channels -04 = 4 channel packa ge x = sot563, 5000 quantity t= t ape & reel g= green gx4 g x 4 product series g = sp3004 series assembl y site (varies) number of channels solder p ad layout
78 revised: august 19, 2010 ?2010 littelfuse, inc. speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. spa? silicon protection array products low capacitance esd protection array sp3004 lead-free/green series embossed carrier tape & reel speci?cation - sot563 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 0.45 0.55 0.017 0.021 p0 3.90 4.10 0.154 0.161 10p0 40.0+/- 0.20 1.574+/-0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 1.73 1.83 0.068 0.072 b0 1.73 1.83 0.068 0.072 k0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max
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